Our Assembly and Testing Processes
For every challenge, identifying the best solution and the right technology is what drives us. Depending on project requirements, we draw on a broad portfolio of proven and partly patented processes. At the same time, we collaborate closely with you to develop new processes as tailored solutions for your specific needs.
Our in-house research and development department is involved at an early stage of each project. This enables us to optimize existing processes or develop new ones whenever current solutions reach their limits. The continuous expansion of our process portfolio and expertise makes Sonplas the ideal partner for demanding custom machine solutions – For your success.
Our Assembly and Manufacturing Processes
HydroEROsive machining Joining and coating Welding Cleaning and material removal Rotor assembly Cutting Laser processing
Joining and Coating
For the precise joining of components, we utilize a range of different joining technologies. A particular focus is on our patented micro-peening process. This is a highly precise press-fit process that enables components to be adjusted with maximum accuracy and without stick-slip effects. The process allows step sizes below 1 µm, press-fit tolerances under ± 2 µm, and cycle times of less than 10 seconds.
In addition, we integrate the following joining and dispensing processes:
- Dispensing
- Force-displacement monitored press-fitting
- Screwdriving
- Brazing
- Pressing
- Thermal staking
- Thermal interference fitting (shrink fitting, hot/cold)
- Splicing
Cleaning and Material Removal
Clean and properly prepared components are the basis for stable assembly processes. Using a range of cleaning and material removal technologies, we reliably remove particles, residues, and contaminants from surfaces, creating optimal conditions for subsequent process steps. Depending on requirements, we apply the following processes:
- Washing
- Laser cleaning
- Plasma cleaning
- Cleaning with ionized air
Cutting
For the precise separation of materials and components, we integrate various cutting technologies into our systems. These include:
- Laser cutting: Enables notching, slitting, and singulation processes. The contactless nature of the process ensures high cutting speeds and a high edge quality with maximum precision.
- Punching: A mechanical cutting process in which material is separated from strip or sheet using a dedicated cutting tool.
Electrical and Magnetic Testing
The testing of electrical and magnetic properties is a key element of many of our systems. We benefit from our in-house electronics manufacturing, where, among other things, contacting solutions for our equipment are developed. In addition, we operate an in-house electronics test laboratory equipped with comprehensive testing equipment, enabling us to develop, validate, and optimize test procedures. This allows us to integrate, among others, the following tests:
- Resistance, inductance, and insulation measurement
- Magnetic field measurement
- Current and power measurement
- High-voltage (HV) testing
- Flashing of calibration data
- Safe launch testing
- Speed measurement
- Impedance spectroscopy
Optical Testing
For automated quality control, we utilize camera-based inspection systems. We rely on a wide range of vision systems from leading manufacturers such as Keyence and Cognex. In addition, our in-house developed image processing system SonVision is continuously enhanced and can be individually adapted and implemented for each customer process. We also employ customized deep learning models that are specifically trained for the respective application. This enables us to integrate the following inspections:
- Dimensional inspection
- Component identification
- Optical character recognition (OCR)
- Surface and defect inspection
- Process documentation
- Process evaluation
- AI-based anomaly detection
- Spray testing
Mechanical and Dynamic Testing
To analyze mechanical properties and dynamic effects, we integrate various testing methods into our systems:
- Force-displacement testing / haptic testing: Used to determine parameters such as opening forces, spring characteristics, or haptic properties.
- Vibration measurement: Vibrations act both as a load on components and as a source of noise emissions. Using contact and non-contact measurement systems combined with advanced analysis methods, vibration behavior can be precisely recorded and evaluated.
- Noise measurement: Noise emissions are a key quality criterion, especially for automotive components. Using established acoustic measurement methods, including laser vibrometer-based techniques, we capture both airborne and structure-borne sound and assess the acoustic performance of components.